Summary about Integrated Circuits Part 2, Testing, Bonding and Packaging, Wire bonding, flip clip techniques, Packeging, .
Semiconductor Technology - Fabrication of MOSFETs
This document about Field-Effect Transistors Part 5, Threshold voltage variations with device lenth and width, Short channel effect, DIBL, Small Geometry effect, Narrow width effect.
Main points of this past exam paper are: Cross-Section, Voltage Transfer Characteristic, Various Regions, Circuit Schematic, Simplified Representation, Combinational Logic Circuit, Stick Diagram,...
Main points of this past exam paper are: Valence Band, Conduction Band, Bandgap, Intrinsic Carrier, Reverse Bias, Forward Bias, Depletion Region, Boron Atoms, Intrinsic Fermi Level, Undoped Sample
Detail Summery about Field-Effect Transistors, Transistor Operation, The Junction fet, Pinch off and saturation, Summary .